Eduvest � Journal of Universal Studies

Volume 4 Number 12, December, 2024

p- ISSN 2775-3735- e-ISSN 2775-3727

NEXT-GENERATION CPU ARCHITECTURES: A STUDY OF THE INFLUENCE OF NANOMETER TECHNOLOGY ON COMPUTER PERFORMANCE

Ija Sudija¹, Jan everhard riwurohi², Muhamad Masruin Masad³

Universitas Budi Luhur, Indonesia^1,2,3

Email: [email protected]¹, [email protected]², [email protected]³

ABSTRACT
Nanometer technology has become one of the most significant innovations in the advancement of modern CPU architecture, enabling substantial improvements in computational performance, energy efficiency, and transistor density. This study examines the impact of 7nm, 5nm, and 3nm technology implementation on CPU performance under various workload scenarios, including multitasking, graphics rendering, and artificial intelligence-based applications. Based on a series of experimental tests, the findings indicate that reducing transistor size directly increases processor speed by up to 30% while reducing power consumption by 20%. However, challenges such as heat dissipation and power leakage become more pronounced with technology below 5nm. Several proposed solutions include the development of more advanced cooling systems and the use of alternative semiconductor materials, such as graphene, to mitigate power leakage. This research provides valuable insights into the future development of CPU architecture and its impact on the technology industry as a whole.
KEYWORDS	Nanometer technology, heat dissipation, power leakage, semiconductor technology, graphene
	This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International

INTRODUCTION

����������� The development of semiconductor technology has become the main driver of innovation in the world of computing (Batra et al., 2019). As the demand for faster and more efficient processor performance increases, the tech industry has focused on developing more powerful and energy-efficient CPU architectures (D. Li et al., 2016). One of the biggest innovations in recent decades has been the shift to nanometer technology in CPU manufacturing, which has allowed chipmakers such as Intel, AMD, and TSMC to fit more transistors into smaller spaces, resulting in faster, more efficient, and more energy-efficient processors.

����������� Nanometer technology refers to the physical size of the transistors used in CPU chips (Liu et al., 2020). A transistor is a fundamental element of an electronic circuit, and by reducing the size of the transistor to the nanometer scale, more transistors can be placed in the same area, leading to improved processor performance (Das et al., 2021). However, miniaturizing transistors to sizes below 7nm not only brings benefits, but also raises a number of technical challenges, especially related to heat dissipation and power leakage (Radamson et al., 2020). Heat dissipation problems arise when more transistors in a smaller space produce more heat that must be dissipated (He et al., 2021). Whereas power leakage occurs when unwanted electric current flows through the transistor, which increases power consumption and decreases efficiency (Prasad & Rim, 2022).

����������� Advances in nanometer technology are particularly relevant in a variety of applications, such as artificial intelligence (AI), data centers, and mobile devices (Gill et al., 2022). The gaming industry, for example, requires CPUs with high graphics performance and low latency, while data center applications require CPUs that are energy-efficient but still have high multitasking capabilities (Alam et al., 2024; Tong, 2024). In the mobile sector, the demand for smaller, more efficient devices is increasing, which makes nanometer technology one of the main focuses in processor development (Atabaki et al., 2018; Miraz et al., 2018).

����������� This study aims to analyze the influence of nanometer technology on CPU performance, focusing on 7nm, 5nm, and 3nm technologies (Radamson et al., 2020; Sherazi et al., 2016). In addition, we examine the challenges of heat dissipation and power leakage, as well as innovative solutions that can be applied in the design of next-generation CPU architectures (Z. Li et al., 2024; Zhang et al., 2023).

����������� The development of semiconductor technology has become a major motor in driving innovation in the computing world (Băjenescu, 2022). As the demand for faster and more efficient processors increases, the tech industry is increasingly focusing on developing more powerful and energy-efficient CPU architectures (Haj-Yahya et al., 2018). One of the biggest breakthroughs in recent decades has been the application of nanometer technology in CPU production, which has allowed manufacturers such as Intel, AMD, and TSMC to embed more transistors into smaller spaces (Kotasthane & Manchi, 2023). As a result, the resulting processor becomes faster, more efficient, and more energy-efficient (Hackenberg et al., 2015).

����������� Nanometer technology refers to the physical size of the transistors used in CPU chips (Liu et al., 2020). By reducing the size of the transistor to the nanometer scale, more transistors can be placed in the same space, which directly improves the performance of the processor (Salahuddin et al., 2018). Although miniaturization of transistors down to 7nm brings significant advantages, the process also presents a variety of technical challenges, particularly related to heat dissipation and power leakage. Heat dissipation problems arise when more transistors in a tight space generate more heat, while power leakage occurs when unwanted electrical current flows through the transistor, leading to increased power consumption and decreased efficiency.

����������� Advances in nanometer technology play a huge role in various applications, such as artificial intelligence (AI), data centers, and mobile devices. For example, the gaming industry requires CPUs with high graphics capabilities and low latency, while data centers require CPUs that are energy-efficient but still have reliable multitasking capabilities. In the mobile sector, the demand for smaller and more efficient devices is increasing, making nanometer technology one of the main focuses in processor development.

����������� This study aims to examine the impact of nanometer technology on CPU performance, with a focus on 7nm, 5nm, and 3nm technologies. In addition, the study will also address the challenges of heat dissipation and power leakage and explore innovative solutions that can be applied in next-generation CPU architecture designs. )

RESEARCH METHOD

This study uses a quantitative approach with experimental methods to measure the impact of nanometer technology on CPU performance in various scenarios. (describe the meaning and procedure of the method accompanied by citations) The CPU samples used in the study include 10nm, 7nm, 5nm, and 3nm-based processors manufactured by Intel, AMD, and TSMC. Testing is carried out in a controlled laboratory environment to ensure consistency of results.

Testing Stage:

1. CPU Sample Selection: We use four generations of CPUs from different manufacturers, each with different fabrication technologies: 10nm, 7nm, 5nm, and 3nm.

2. Performance Testing: Performance testing is conducted using Cinebench R23 and Geekbench 5 benchmark software, which is designed to measure the performance of single-core and multi-core CPUs. We also did multitasking testing using graphics rendering applications like Blender and big data processing using Hadoop.

3. Power Consumption Testing: Power consumption is measured in three conditions: idle (no workload), moderate load (e.g. video playback or light applications), and heavy load (large graphics or simulation processing). Measurements are made using a power meter capable of recording changes in power consumption in real-time during testing.

4. Operating Temperature Testing: The operating temperature of the CPU is measured using thermal sensors mounted on the heat sink and surface of the CPU. The test was carried out under two conditions: idle and full load, using a standard cooling system (fan) and a liquid cooling system.

5. Power Leakage Analysis: We use power leakage analysis to measure how much energy is lost through a dormant transistor. This is done by using simulation software to simulate intense workloads.

RESULT AND DISCUSSION

The test results show that 7nm technology provides a significant performance improvement compared to 10nm technology. In the Cinebench R23 test, the 7nm-based CPU scored a single-core score of 1500 points, while the 10nm CPU only reached 1300 points. The 7nm CPU's multi-core score also shows a 25% improvement compared to 10nm, reflecting better multitasking capabilities.

At 5nm technology, CPU performance improves even further. The multi-core score reaches 17,500 points, while power consumption is reduced by up to 20% compared to 7nm CPUs. This shows that 5nm technology is more efficient in terms of performance and power, which is particularly relevant for data center and cloud computing applications. However, in 3nm technology, despite a 30% increase in performance compared to 5nm technology, the CPU's operating temperature increases significantly. In full-load testing, 3nm-based CPUs achieved an operating temperature of 80�C, 8�C higher than 5nm CPUs, which indicates greater heat dissipation challenges. Power leakage is also increasing in this technology. (Accompany with pictures/tables if available as research evidence)

Discussion

The results of this study provide clear insights into the influence of nanometer technology on CPU performance. In general, reducing the size of the transistor from 10nm to 3nm results in significant improvements in computing performance, especially in tasks that require parallel execution and graphics processing. This increase is especially important in sectors such as gaming, artificial intelligence (AI), and data centers that require high computing power. In Cinebench R23 and Geekbench 5 tests, 5nm and 3nm-based CPUs showed much better multitasking capabilities compared to 7nm and 10nm-based CPUs, confirming the positive impact of transistor miniaturization.

However, this performance improvement comes with technical challenges that must be overcome. One of the main challenges found is heat dissipation in 3nm-based CPUs. Although 3nm technology delivers the best performance in multi-core tests, higher operating temperatures indicate that standard cooling systems (fans) may no longer be sufficient to maintain the thermal stability of the CPU under heavy loads. Therefore, solutions such as liquid cooling systems or phase-change cooling need to be considered to maintain the CPU temperature within safe limits. This increase in heat dissipation is mainly due to the increasing density of transistors, which results in more heat energy to expend.

In addition to heat dissipation, power leakage is another challenge in technologies below 5nm. 3nm-based CPUs show a 7% increase in power leakage compared to 5nm-based CPUs. This happens because the smaller distance between the transistors causes unwanted electrical current to flow through the inactive transistor, increasing overall power consumption. This power leakage is a serious problem in the context of data center applications that require high energy efficiency to manage thousands of servers simultaneously.

To address this issue, recent research suggests that the use of alternative semiconductor materials such as graphene and carbon nanotubes can help reduce power leakage. This material has better thermal conductivity than silicon, which can help solve the problems of heat dissipation and power leakage in nanometer technology below 5nm. In addition, more advanced FinFET and GAAFET technologies are also being developed to reduce the effects of power leakage without sacrificing performance.

Although 3nm technology offers significant performance improvements, its mass adoption still requires further development in terms of cooling technology and semiconductor materials. Heterogeneous architectural solutions, such as those implemented by Apple in 5nm-based M1 processors, could be a model for future CPU development. This architecture combines high-performance cores and power-efficient cores to improve multitasking performance while minimizing power consumption on lighter tasks.

Overall, the development of nanometer technology is an important step in the evolution of CPU architecture, but the problems of heat dissipation and power leakage must be addressed to ensure the stability and efficiency of next-generation CPUs.

CONCLUSION

����������� Nanometer technology (already) brings many advantages in the development of CPU architectures, including improved performance, energy efficiency, and multitasking capabilities. The study showed that reducing the size of the transistor from 10nm to 3nm provided a (significant) increase in computing performance, with 3nm-based CPUs providing the best performance in multi-core testing. However, heat dissipation and power leakage are technical challenges that must be overcome, especially in technologies below 5nm.

����������� To ensure the success of next-generation nanometer technology, further developments in cooling technology and semiconductor materials are needed. Materials such as graphene and liquid cooling technology offer a promising solution to this problem. Additionally, the adoption of heterogeneous CPU architectures can help improve performance and energy efficiency, especially in applications that require high computing power such as AI and data centers.

����������� More research is needed to explore how heat dissipation can be optimized on 3nm-based CPUs or smaller. The future of the semiconductor industry relies heavily on innovations in materials and cooling technologies to maximize the potential of nanometer technology below 5nm.

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